
Direct Bury Metal Free (DBMF) offers superior network protection with PE microduct assemblies designed for low friction performance. Each bundle features water-blocking tape to prevent moisture ingress, and is protected by two layers: a flexible black PE sheath and a durable orange direct burial-grade PE sheath, ensuring maximum protection and long-term reliability.
Applications and Installations
Direct Bury metal free (DBmf) - Traditional Microduct Tube Bundle
Low-friction liner reduces time and effort during fiber installation.
Blowing track performance confirmed up to 2000 meters.
Microducts are tested according to IEC 60794-5 standards.
Pressure tight up to 15 bar.
Provides UV resistance for up to 2 years in EU conditions.
MHT2803.pdf
Emtelle-Telecom-Catalogue-UK.pdf
At Emtelle, we provide a wide range of associated products designed to complement and enhance your network infrastructure. These components support efficient installation, secure connections, and long-term reliability, ensuring every part of your build works seamlessly together. Trusted globally, our solutions are engineered for performance across all environments.
Direct Bury metal free (DBmf) - Thick Wall Microduct Tube Bundle
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Direct Bury Metal Free (DBMF) solutions feature high-performance microducts with ultra-low friction for easy installation.
Direct Bury with foil (DB) Microduct Tube Bundle
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Direct Bury assembly is surrounded with an aluminium layer, bonded inside a sheath of flexible black PE with a heavy-duty orange-coloured HDPE sheath, making the product suitable for direct burial.
Direct Install (DI) with foil Microduct Tube Bundle
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Direct Install with Foil is designed for direct-in-duct applications, featuring a durable aluminium layer bonded within a flexible black PE sheath.
Direct Install (DImf) Metal Free Microduct Tube Bundle
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Metal-free assemblies of PE microducts (10 or 12mm), each with low friction performance. Each assembly (bundle) is surrounded by an overlapped metal-free layer that reacts to help block water movement.
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